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TempPack FORUM C O - L O C A T E D I N S A N D I E G O , C A L I F O R N I A M A R R I O T T M A R Q U I S S A N D I E G O M A R I N A March 20 - 23, 2018 ISTA's TransPack Forum provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport. The program is designed to create opportunities for you to network with like-minded professionals who are facing the same challenges. Expect to build new relationships and create resources with people centered on the transport packaging industry. Check out the program and register today! • Packaging Performance Testing Applications and Research • Challenges of Protective Package Design • Quality Assurance and Validation Best Practices • Damage Reduction Success Stories • e-Commerce Packaging • Sustainable Packaging Development • Optimization of Packaging Systems Case Studies March 20 - 22, 2018 We are pleased to introduce, ISTA's TempPack Forum. The TempPack Forum brings together professionals to focus on technical topics related to global temperature controlled performance packaging. The TempPack Forum creates an opportunity for presenters to share their insights, challenges, knowledge, case studies and research having a direct impact on the packaging industry.Check out the program and register today! • Developing Thermal Profiles • Cost Reduction • Standardizing Temperature Controlled Packaging • Sustainability • e-Commerce in Temperature Controlled Packaging Two events, in the same great location, sharing networking and exhibition activities and offering an opportunity for our packaging community to connect, learn and grow!

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