ISTA Views

MAY | 2018

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4 ista views • May 2018 • We are pleased to share we successfully hosted the ISTA Forum last March in beautiful San Diego, California! For the first time, the ISTA Forum included co-located events TransPack and TempPack. More than 350 professionals from around the globe of packaging and logistics learned from experts about the industry's most pressing challenges and opportunities while enjoying the entertaining networking opportunities. Brian Wagner of Ameripen provided a powerful keynote presentation to both TransPack and TempPack attendees as he shared his perspective on Packaging in the Fourth Dimension and the packaging design opportunities it can offer. The TransPack program included speakers from Adept Packaging, ASML, Atlantic Packaging, Bush Bros., Cal Poly, Chainalytics, Corruven, Danish Technological Institute, DowDuPont, Genentech, IBM, Jinan University, Michigan State University, More from Less, Packaging Forensics Associations, USMC, PA Consulting, Pregis, Smithers Pira, Smurfit Kappa, Sonoco, Veritiv, Vibration Research and Virginia Tech. With the focus of global temperature controlled performance packaging, the TempPack program included speakers from AeroSafe Global, Chainalytics, Danish Technological Institute, Genentech, Eli Lilly and Company, Modality Solutions LLC, Network Partners, Korea Conformity Laboratories, Lifoam, Smithers Pira, Sonoco ThermoSafe and UPS. The TransPack and TempPack programs were designed to allow attendees the opportunity to share networking and exhibition events. The welcome reception included a special evening of food and virtual reality gaming fun while enjoying the San Diego weather on the Marriott's outdoor terrace. This event was made possible by our Diamond Sponsors PCA, Westpak, Lansmont, Veritiv, Safe Load, DDL, Corruven and Lifoam. On Thursday evening, attendees had a lot of fun unwinding and networking while playing an interactive game of trivia. Thank you to Platinum Sponsors L.A.B. Equipment, SGS and TLS for supporting this event and making it possible. Two popular training programs, Certified Packaging Laboratory Professional (CPLP) and Responsible Packaging by Design (RPbD) were held prior to the start of the Forum. Both Technician and Technologist CPLP levels were offered along with RPbD professional certification. Larry Dull, ISTA's Lead Instructor conducted all the training sessions. Thank you to all of our attendees, sponsors, speakers and exhibitors for coming together to network and learn. We are pleased to announce that we will be hosting the 2019 ISTA Forum which will include TransPack and TempPack on May 13th – 16th in Denver, Colorado at the brand-new Gaylord Rockies Resort & Convention Center. Mark your calendars and we hope that you will be able to join us for another great Forum! A Successful 2018 ISTA Forum in San Diego, California!

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