ISTA Views

JULY | 2016

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Introduction: Designing robust products/packaging in order to survive the transport/handling process and arrive in pristine condition to the customer is challenging, no matter the product. When it comes to ship testing, often we look no further than off- the-shelf equipment/standards. However, off-the-shelf shock, drop, vibration, impact, and compression testers may not meet your specific needs. ISTA and ASTM standards may not provide a procedure tailored to your distribution environment; understanding the environment is a basic but crucial aspect of packaging to ensure acceptable delivery of the product to the customer. Simulation testing should mimic your specific environment, if not, the testing is not representative and the results will not have the greatest impact possible. This paper will provide guidance for decisions regarding testing and equipment as well as provide new simulation tests developed at General Electric Appliance Park. > inside Inside ISTA Headquarters • 2016 TransPack Forum Highlights • R. David LeButt Award • ISTA Advocate Research and Value Deliver Program Update & First Project Awarded • New ISTA Board Members • ISTA Webinars & Workshops • First Asia Pacific Symposium • Call for ISTA European Committee Participants • New Member Search Tool • ISTA Becomes PACK EXPO International Partner pages 2-13 Welcome New Members & Membership News pages 14-15 CPLP Corner pages 16-17 ISTA Technical Update pages 18-19 Simulation Testing to Replicate Packaging and Product Damage in the Field The following paper was recently presented at ISTA's 2016 TransPack Forum in Orlando, Florida. Alexander J. Hagedorn, PhD, CPLP, Lead Program Manager - Packaging Engineer, General Electric - Appliances & Lighting July 2016 • TM > MORE ON PAGE 3 > MORE ON PAGE 20 ISTA Member Receives CPLP- Professional Status ISTA is pleased to announce the qualification of ISTA's newest CPLP Professional, Chris Phan from Chris joins an exclusive list of professionals worldwide who have earned both the CPLP Technician and Technologist levels, and have completed a resume of activities, employment and education that have qualified Chris Phan April 18-21, 2017 Disney's Yacht & Beach Club Resorts, Orlando, Florida Call for Speakers Speaking at ISTA's TransPack Forum is a powerful opportunity to share your knowledge and perspective on packaging. If you have an interesting and informative topic or case study related to the economic, social or environmental optimization of packaging systems, we want to hear about it. Visit for more information.

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